Inductively Coupled Plasma Enhanced Chemical Vapor Deposition
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United States of America Patent
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Apr 7, 2016
app pub date -
Jul 14, 2015
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Oct 1, 2014
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Abstract
A deposition system may have at least a substrate mounted within a sealed chamber. A radio frequency energy can be supplied to an inductive source affixed to the sealed chamber with the inductive source having an inductive coil surrounding a tube. Coupling the radio frequency energy into a gas pumped into the sealed chamber creates plasma to uniformly deposit a thin layer on a surface of the substrate.
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