POLYIMIDE RESIN AND POLYIMIDE FILM PRODUCED THEREFROM

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United States of America Patent

APP PUB NO 20160096952A1
SERIAL NO

14388488

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Abstract

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Disclosed herein is a polyimide resin including a silica filler surface-treated with a fluorine-containing compound, and a polyimide film formed using the polyimide resin. The polyimide resin has improved dispersibility and heat resistance because the surface of a silica filler is fluorinated.

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Patent Owner(s)

Patent OwnerAddress
KOLON INDUSTRIES INC(MAGOK-DONG) 110 MAGOKDONG-RO GANGSEO-GU SEOUL 07793

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JU, Chul Ha Yongin-si, KR 8 88
JUNG, Hak Gee Yongin-si, KR 42 245
PARK, Hyo Jun Yongin-si, KR 42 241

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