Polyamide Resin, Method for Preparing the Same, and Molded Article Including the Same
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United States of America Patent
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Apr 7, 2016
app pub date -
Jan 16, 2015
filing date -
Oct 1, 2014
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A polyamide resin is a polymer of an adipic acid-containing dicarboxylic acid component and an m-xylenediamine-containing diamine component, wherein the polymer includes about 100 ppm or less of phosphorus and about 100 ppm or less of sodium (Na), and has a gel content of about 0.5% or less as measured on a specimen prepared by melting about 10 g of the polymer at about 260° C., maintaining the molten polymer for about 30 minutes, and then cooling the molten polymer to room temperature. The polyamide resin can exhibit excellent heat resistance and can reduce or prevent gel generation upon polymerization or molding.
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