HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20160095251A1
SERIAL NO

14526272

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The heat dissipation device includes a heat absorbing base and a fan mounted on the heat absorbing base. The heat absorbing base includes a first surface configured for contacting a heat generating element, and a second surface opposite to the first surface. The fan includes a bearing and a rotor pivotally coupled with the bearing. The bearing is mounted on the second surface of the heat absorbing base.

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Patent Owner(s)

Patent OwnerAddress
FOXCONN TECHNOLOGY CO LTD(236)NO 3-2 CHUNG SHAN ROAD TU-CHENG DIST NEW TAIPEI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUNG, JUI-WEN New Taipei, TW 43 281
LIN, YU-CHING New Taipei, TW 55 386

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