MOBILE PHONES WITH HEAT DISSIPATION COMPONENTS, MANUFACTURING METHOD AND HEAT DISSIPATION DEVICE THEREFOR
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United States of America Patent
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Issued Date -
Mar 31, 2016
app pub date -
Sep 30, 2015
filing date -
Sep 30, 2014
priority date (Note) -
Abandoned
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Abstract
A mobile phone is provided. A heating component has a heating surface. A heat dissipation component has a heat absorbing surface. A thermal phase-change material layer is thermally connected between the heating surface and the heat absorbing surface and has a phase-change temperature. The thermal phase-change material layer is manufactured by silk screen printing, and space between the heat absorbing surface and the heating surface is less than or equal 0.1 mm. A manufacture method for the mobile phone is provided. By the method, when a temperature of the heating component reaches or exceeds the phase-change temperature, the thermal phase-change material layer is changed to a melting phase from a solid phase and fills the space between the heating component and the heat dissipation component. So as to conduct the heat of the heating component to the heat dissipation component, thus improving the heat dissipation performance of the mobile phone.
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