SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Aug 20, 2015
filing date -
Sep 30, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor device includes: a semiconductor substrate; a ferroelectric capacitor above the semiconductor substrate; a first guard ring around the ferroelectric capacitor above the semiconductor substrate. The ferroelectric capacitor includes a bottom electrode, a capacitor insulating film and a top electrode. The first guard ring includes a first pseudo bottom electrode, a first pseudo capacitor insulating film and a first pseudo top electrode, and surrounds the ferroelectric capacitors in planar view.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
FUJITSU SEMICONDUCTOR LIMITED | 2-10-23 SHIN-YOKOHAMA KOHOKU-KU YOKOHAMA-SHI KANAGAWA 222-0033 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
SASHIDA, Naoya | Kuwana, JP | 48 | 439 |
# of filed Patents : 48 Total Citations : 439 | |||
SUGIMACHI, TATSUYA | KUWANA, JP | 6 | 35 |
# of filed Patents : 6 Total Citations : 35 |
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Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 13.47 % this patent is cited more than
- 9 Age
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