NON-INSULATED POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Mar 31, 2016
app pub date -
Sep 17, 2015
filing date -
Sep 30, 2014
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Abandoned
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Abstract
A non-insulated power semiconductor module may include a housing, at least a pair of lead frames fixedly seated in the housing and having a plurality of power semiconductor chips mounted on surfaces thereof, and an insulation member disposed between the housing and the pair of lead frames.
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