QUAD-FLAT NON-LEAD PACKAGE STRUCTURE AND METHOD OF PACKAGING THE SAME
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United States of America Patent
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Issued Date -
Mar 31, 2016
app pub date -
Nov 7, 2014
filing date -
Sep 30, 2014
priority date (Note) -
Abandoned
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Abstract
A quad-flat non-lead package structure includes a film layer, a conducting layer, a die, an encapsulant, and a plurality of metal bumps. The film layer has a plurality of through holes. A pad of the conducting layer and conducting wirings are disposed at the film layer but are not connected to each other. The conducting wirings are disposed at the through holes, respectively. The die is fixedly disposed at the pad and electrically connected to the conducting wirings. The encapsulant covers the conducting layer and the die. The metal bumps are disposed in the through holes, respectively, each have one end electrically connected to a corresponding one of the conducting wirings, and each have the other end protruding from a corresponding one of the through holes. Accordingly, the quad-flat non-lead package structure features reduced likelihood of pin disconnection and enhanced adhesiveness required for surface-mount technology.
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