SUBSTRATE PROCESSING APPARATUS

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United States of America Patent

APP PUB NO 20160090651A1
SERIAL NO

14841106

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus includes a processing chamber configured to accommodate a substrate therein; a first processing gas supply part configured to supply a first processing gas to the substrate, the first processing gas supply part including a vaporizer configured to vaporize a first processing gas precursor into the first processing gas; a second processing gas supply part configured to supply a second processing gas to the substrate; a vaporizer remaining amount measuring part configured to measure a remaining amount of the first processing gas precursor within the vaporizer; and a control part configured to adjust a number of cycles for supplying the first processing gas and the second processing gas based on the remaining amount of the first processing gas precursor.

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Patent Owner(s)

Patent OwnerAddress
HITACHI KOKUSAI ELECTRIC INC15-12 NISHI-SHIMBASHI 2-CHOME MINATO-KU TOKYO 105-8039

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ASHIHARA, Hiroshi Toyama-shi, JP 76 2625
OHASHI, Naofumi Toyama, JP 148 697

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