MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE WITH LOW SUBSTRATE CAPACITIVE COUPLING EFFECT
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United States of America Patent
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Issued Date -
Mar 31, 2016
app pub date -
Jul 2, 2015
filing date -
Sep 26, 2014
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Abstract
The present invention discloses a MEMS device with low substrate capacitive coupling effect, which is manufactured by a CMOS manufacturing process. The MEMS device includes: a substrate; at least one anchor, including an oxide layer connected with the substrate and a connecting structure on the oxide layer; and at least one micro-electro-mechanical structure, connected with the connecting structure. The oxide layer is made by a process step corresponding to a process step for making a field oxide which defines a device region of a transistor in the CMOS manufacturing process. The connecting structure has at least one layer which has an out-of-plane projected area that is smaller than an out-of-plane projected area of the oxide layer. The substrate has plural recesses at an upper surface of the substrate facing the micro-electro-mechanical structure.
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