METHOD AND APPARATUS TO REDUCE THERMAL RESISTANCE IN A SERVER CHASSIS
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United States of America Patent
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Issued Date -
Mar 24, 2016
app pub date -
Sep 3, 2015
filing date -
Sep 4, 2014
priority date (Note) -
Abandoned
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Abstract
A server chassis includes add-on cards, interposer elements, and an interconnect subsystem including back planes. The interposer elements are physically connect to the at least two back planes and to the add-on cards therefore electrically coupling the add-on cards to the back planes. The add-on cards are configured in a stacked position such that unobstructed air flows between the add-on cards and through a space defined to be in between the back planes so that unobstructed air flow causes lowering of thermal resistance associated with the server chassis.
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