Rough Copper for Noise Reduction in High Speed Circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Mar 24, 2016
app pub date -
Sep 22, 2014
filing date -
Sep 22, 2014
priority date (Note) -
Published
status (Latency Note)
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Importance

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Abstract
A method includes providing, on a printed circuit board, a first copper layer having a first surface roughness, forming, by the first copper layer a power trace to a circuit device, providing, on the printed circuit board, a second copper layer having a second surface roughness, wherein the first surface roughness is greater than the second surface roughness, and forming, by the second copper layer, a signal trace to the circuit device.
First Claim
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Family
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
DELL PRODUCTS LP | ONE DELL WAY ROUND ROCK TX 78682 |
International Classification(s)

- 2014 Application Filing Year
- C25D Class
- 592 Applications Filed
- 449 Patents Issued To-Date
- 75.85 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Farkas, Sandor | Round Rock, US | 150 | 451 |
# of filed Patents : 150 Total Citations : 451 | |||
Mutnury, Bhyrav M | Round Rock, US | 220 | 1013 |
# of filed Patents : 220 Total Citations : 1013 |
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Patent Citation Ranking
- 0 Citation Count
- C25D Class
- 0 % this patent is cited more than
- 9 Age
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 24, 2027 |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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