Rough Copper for Noise Reduction in High Speed Circuits

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United States of America Patent

APP PUB NO 20160088722A1
SERIAL NO

14492867

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Abstract

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A method includes providing, on a printed circuit board, a first copper layer having a first surface roughness, forming, by the first copper layer a power trace to a circuit device, providing, on the printed circuit board, a second copper layer having a second surface roughness, wherein the first surface roughness is greater than the second surface roughness, and forming, by the second copper layer, a signal trace to the circuit device.

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Patent Owner(s)

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DELL PRODUCTS LPONE DELL WAY ROUND ROCK TX 78682

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  • 2014 Application Filing Year
  • C25D Class
  • 592 Applications Filed
  • 449 Patents Issued To-Date
  • 75.85 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farkas, Sandor Round Rock, US 150 451
Mutnury, Bhyrav M Round Rock, US 220 1013

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1262923413432201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 80020406080100120140160180200220240260280300320

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