EPITAXIAL SILICON WAFER

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United States of America Patent

APP PUB NO 20160087049A1
SERIAL NO

14856005

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Abstract

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An epitaxial silicon wafer includes: a silicon wafer; and a silicon epitaxial layer formed on the silicon wafer, in which a W concentration obtained by a metal analysis of a surface of the silicon epitaxial layer using an inductively coupled plasma mass spectrometry is 1×106 atoms/cm2 or less. Further, the W concentration obtained by the metal analysis of the surface of the silicon epitaxial layer using the inductively coupled plasma mass spectrometry is preferably 1×107 atoms/cm2 or less.

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Patent Owner(s)

Patent OwnerAddress
SUMCO CORPORATION2-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 105-8634

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
GOTO, Motoki Tokyo, JP 3 0
KUROZUMI, Yusuke Tokyo, JP 3 4
TAKAMIYA, Hitoshi Tokyo, JP 2 0
YOSHITAKE, Kan Tokyo, JP 3 2

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