ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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United States of America Patent
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Mar 24, 2016
app pub date -
May 27, 2014
filing date -
May 28, 2013
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An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having a reactive double bond group, and a filler (C) having a reactive double bond group on a surface thereof. The acrylic polymer (A) has a weight average molecular weight of 500,000 or more, and the heat curable resin (B) comprises an epoxy resin and a heat curing agent, in which at least one of the epoxy resin and the heat curing agent has the reactive double bond group.
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