SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Mar 24, 2016
app pub date -
Mar 30, 2015
filing date -
Sep 19, 2014
priority date (Note) -
Abandoned
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Abstract
The present invention provides a semiconductor structure and a method of fabricating the same. The semiconductor structure includes a carrier, a semiconductor chip and an encapsulant. The semiconductor chip is disposed on the carrier, and has opposing non-active and active surfaces. The non-active surface is coupled to the carrier, and the active surface has a plurality of metallic pillars formed thereon. A under bump metallogy layer is formed between the metallic pillars and the active surface and on side surfaces of the metal pillars. The surface of the encapsulant is flush with end surfaces of the metallic pillars. Therefore, the product yield is increased significantly.
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