PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Mar 24, 2016
app pub date -
Jul 22, 2015
filing date -
Sep 18, 2014
priority date (Note) -
Abandoned
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Abstract
A package substrate includes a substrate body having a first surface and a second surface opposite to the first surface; a first circuit layer formed on the first surface and having first conductive pads; a first dielectric layer formed on the first surface and the first circuit; a second circuit layer formed on the first dielectric layer and having second conductive pads; a third circuit layer formed on the second surface and having third conductive pads; a second dielectric layer formed on the second surface and the third circuit layer; a fourth circuit layer formed on the second dielectric layer and having fourth conductive pads; through holes penetrating through the first and second surfaces, and the first and second dielectric layers; and conductive vias penetrating through the through holes and electrically connected to the first, second, third and fourth conductive pads.
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