Substrate Processing Apparatus, Gas Introduction Shaft and Gas Supply Plate

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United States of America Patent

APP PUB NO 20160083844A1
SERIAL NO

14826782

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a substrate processing apparatus including: a substrate support unit; a gas supply plate including a plurality of gas distribution pipes connected to a plurality of gas supply regions; and a gas introduction shaft mounted on the gas supply plate. The gas introduction shaft includes a plurality of gas introduction pipes. Each of the plurality of gas introduction pipes is connected to each of the plurality of gas distribution pipes via each of a plurality of gas discharging spaces having an annular shape.

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Patent Owner(s)

Patent OwnerAddress
HITACHI KOKUSAI ELECTRIC INCTOKYO 105-8039

International Classification(s)

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  • 2015 Application Filing Year
  • C23C Class
  • 3009 Applications Filed
  • 2118 Patents Issued To-Date
  • 70.39 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NISHITANI, Eisuke Toyama, JP 65 2257
TOYODA, Kazuyuki Toyama, JP 75 2553

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Patent Citation Ranking

  • 50 Citation Count
  • C23C Class
  • 97.27 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges27293913750251255742501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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