Method for manufacturing copper alloy and copper alloy

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United States of America Patent

PATENT NO 10329654
APP PUB NO 20160083826A1
SERIAL NO

14955318

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Abstract

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A method for manufacturing a copper alloy of the present invention is a method for manufacturing a Cu—Ni—Sn-based copper alloy and includes: a first aging treatment step of performing an aging treatment in a temperature range of 300° C. to 500° C. using a solution treated material; an inter-aging processing step of performing cold working after the first aging treatment step; and a second aging treatment step of performing an aging treatment in a temperature range of 300° C. to 500° C. after the inter-aging processing step. In the first aging treatment step, a peak aging treatment is preferably performed. In addition, in the second aging treatment step, the aging treatment is preferably performed for a short period as compared to that of the aging treatment in the first aging treatment step. In the inter-aging processing step, cold working is preferably performed at a processing rate of more than 60% to 99%.

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Patent Owner(s)

Patent OwnerAddress
NGK INSULATORS LTDJAPAN'S AICHI PREFECTURE NAGOYA NAGOYA CITY AICHI
NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITYNU7 KAKUMA-MACHI KANAZAWA-SHI ISHIKAWA 920-1164

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Monzen, Ryoichi Kanazawa, JP 1 0
Muramatsu, Naokuni Nagoya, JP 42 208

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