A METHOD OF PREPARING A CONDUCTIVE METALLIC LAYER OR PATTERN
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United States of America Patent
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Issued Date -
Mar 24, 2016
app pub date -
Jul 2, 2014
filing date -
Jul 4, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A method of preparing a conductive metallic layer or pattern includes the steps of applying a metallic nanoparticle dispersion on a support to obtain a metallic layer or pattern, and contacting the metallic layer or pattern with a solution containing an acid or an acid precursor capable of releasing the acid during curing of the metallic layer or pattern. It has been observed that by contacting the metallic layer or pattern with a solution containing an acid or an acid precursor capable of releasing the acid, higher conductivities at moderate curing conditions are obtained.
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| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| KR | A | KR20170119747 | Jul 02, 2014 |
| WO | A1 | WO2015000932 | Jul 02, 2014 |
| CN | B | CN105340370 | Jul 02, 2014 |
| EP | A1 | EP3017664 | Jul 02, 2014 |
| JP | B2 | JP6190053 | Jul 02, 2014 |
| KR | A | KR20160015273 | Jul 02, 2014 |
International Classification(s)
- 2014 Application Filing Year
- B05D Class
- 1412 Applications Filed
- 1025 Patents Issued To-Date
- 72.60 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 3 Citation Count
- B05D Class
- 26.78 % this patent is cited more than
- 9 Age