Polishing pad, polishing apparatus and method for manufacturing polishing pad

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United States of America Patent

PATENT NO 10022836
APP PUB NO 20160082568A1
SERIAL NO

14848147

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Abstract

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The present invention relates to a polishing pad comprising a base sheet containing a restriction layer. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.

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Patent Owner(s)

Patent OwnerAddress
SAN FANG CHEMICAL INDUSTRY CO LTD402 FENGJEN RD JENWU DIST KAOHSIUNG CITY

International Classification(s)

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  • 2015 Application Filing Year
  • B24B Class
  • 630 Applications Filed
  • 508 Patents Issued To-Date
  • 80.64 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Chung-Chih Kaohsiung, TW 112 308
Hung, Yung-Chang Kaohsiung, TW 45 119
Liu, Wei-Te Kaohsiung, TW 10 28
Wang, Chun-Ta Kaohsiung, TW 13 25
Yao, I-Peng Kaohsiung, TW 79 189

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Patent Citation Ranking

  • 1 Citation Count
  • B24B Class
  • 37.85 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges35253732521101 - 1011 - 2021 - 3031 - 4041 - 5051 - 600255075100125150175200225250275300325350375400425450475500525550575

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