PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
Mar 17, 2016
app pub date -
Jan 28, 2015
filing date -
Sep 12, 2014
priority date (Note) -
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Abstract
A package structure is provided, including an electronic element with a low frequency, a shielding member connected to the electrosnic element, and an encapsulant covering the electronic element and the shielding member, such that the electronic element is shielded from erroneous signals.
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