WIRING BOARD PROVIDED WITH THROUGH ELECTRODE, METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR DEVICE
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United States of America Patent
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app pub date -
Nov 27, 2015
filing date -
May 31, 2013
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Abstract
A manufacturing method for forming a wiring board provided with a through electrode includes steps of: a step for forming, to a first layer, a wiring layer and a portion for a land where the through electrode is provided, the wiring and the portion for the land being formed in glass; a step for forming a metal layer on only a front surface of the glass; a step for forming a through hole in the glass only at a portion between the land where the through electrode of the back surface is provided and the land corresponding to the front surface thereof; a step for filling the through hole with a conductive material; a step for forming a metal layer on the back surface; and a step for polishing the metal layer on the front and back surfaces of the glass until a glass surface is exposed.
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