Micropillar-enabled thermal ground plane
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 4, 2020
Grant Date -
Mar 17, 2016
app pub date -
Sep 17, 2015
filing date -
Sep 17, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.
First Claim
Other Claims data not available
Family
Loading Family data...
International Classification(s)
- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 41.95 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 4, 2028 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 4, 2032 |
