COPPER CLEANING AND PROTECTION FORMULATIONS
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United States of America Patent
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Mar 17, 2016
app pub date -
Apr 22, 2014
filing date -
Apr 22, 2013
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Abstract
A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include corrosion inhibitor(s) and surfactant(s). The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
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