INKJET PRINTHEAD comprising silicon-on-insulator substrate
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United States of America Patent
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Issued Date -
Mar 17, 2016
app pub date -
Sep 2, 2015
filing date -
Sep 17, 2014
priority date (Note) -
Abandoned
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Abstract
An inkjet printhead integrated circuit includes: a silicon-on-insulator substrate having a first layer of silicon, an insulator layer disposed on the first layer of silicon and a second layer of silicon disposed on the insulator layer; a nozzle plate disposed on the second layer of silicon; and embedded inkjet nozzle devices. Each inkjet nozzle device includes a nozzle chamber defined in the second layer of silicon, each nozzle chamber having a roof which is part of the nozzle plate; an actuator for ejecting ink through the nozzle opening; and drive circuitry connected to the actuator.
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