METHOD FOR FORMING METAL PATTERN AND SUBSTRATE HAVING THE SAME
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United States of America Patent
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Issued Date -
Mar 10, 2016
app pub date -
Aug 6, 2015
filing date -
Sep 4, 2014
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Abstract
A method for forming a metal pattern on a substrate having at least one metal component is provided. By performing the surface passivation treatment on the at least metal component, the surface of the at least metal component becomes an anti-plating surface via an anti-plating coating. Hence, the metal pattern can be selectively formed in the following electroless plating processes.
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