SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
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United States of America Patent
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app pub date -
Nov 6, 2015
filing date -
May 31, 2012
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Abstract
A semiconductor device includes a substrate having a top surface. A semiconductor circuit defines a circuit area on the top surface of the substrate. An interconnect is spaced apart from the circuit area and extends from the top surface into the substrate. The interconnect includes a sidewall formed of an electrically insulating material. An opening is provided in the sidewall.
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