THERMOSETTING MATERIALS WITH IMPROVED FRACTURE TOUGHNESS
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United States of America Patent
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Mar 10, 2016
app pub date -
Apr 10, 2014
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Apr 22, 2013
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The present invention relates to a composition including, by weight, the total being 100%: 50 to 99% of a curable resin and of a curing agent in a molar ratio in the range of 1/5 to 5/1, and 1 to 50% of a mixture: of a polyamide which includes at least one monomer resulting from the condensation of a diacid and of a diamine of formula (1) where:
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