Polyester based copolymer resin and molded product comprising the same
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United States of America Patent
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Jul 21, 2020
Grant Date -
Mar 10, 2016
app pub date -
Apr 30, 2014
filing date -
May 2, 2013
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Abstract
A polyester based copolymer resin which can be used a heat shrinkable film is disclosed. The polyester based copolymer resin includes a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid, and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4′-(hydroxymethyl)cyclohexane carboxylate and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol. The heat shrinkable film including polyester based copolymer resin has a shrinkage initiation temperature of 60° C. or less, the maximum heat shrinkage rate at 60° C. of 4% or more, and the maximum heat shrinkage rate at 90° C. of 80% or more.
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