Optical substrates having light collimating and diffusion structures
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 10, 2016
app pub date -
Sep 30, 2015
filing date -
Mar 26, 2010
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
This invention discloses a method of forming an uneven structure on a substrate. Use a hard tool to penetrate into a mold to cut a first trench and a second trench in an order on a surface of a mold, wherein the hard tool has a smoothly-curved shape such that the transverse width of each of the first trench and the second trench increases as the penetrating depth of the hard tool increases, wherein when each of the first trench and the second trench marches along a first direction, the penetrating depth of the hard tool is controlled by repeating moving the hard tool up and down to cut the mold such that the transverse width of each of the first trench and the second trench varies according to the controlled penetrating depth of the hard tool, wherein the first trench and the second trench completely overlap with each other with no space therebetween. Then, use the surface of the mold to emboss a thin film on a substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully