PART-EMBEDDED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING SAME

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United States of America Patent

APP PUB NO 20160066418A1
SERIAL NO

14841720

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Abstract

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A method for manufacturing a part-embedded circuit structure includes: forming an inner resist layer with an opening on a base member to expose a portion of the base member; forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer; laminating a dielectric layer on the inner wiring layer; forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer; and removing the base member to expose the inner wiring layer in the opening and the inner resist layer such that a level plane is formed.

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Patent Owner(s)

Patent OwnerAddress
FUKUI PRECISION COMPONENT (SHENZHEN) CO LTDSHENZHEN
ZHEN DING TECHNOLOGY CO LTDNO 6 LANE 28 SAN HO RD SAN SHI VILLAGE TAYUAN TAOYUAN
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTDNO 18 TENGFEI ROAD ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE QINHUANGDAO 066000

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  • 2015 Application Filing Year
  • H05K Class
  • 5482 Applications Filed
  • 4298 Patents Issued To-Date
  • 78.41 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHENG, YU-HAO New Taipei, TW 1 0
HU, WEN-HUNG New Taipei, TW 30 277
WANG, YUE Qinhuangdao, CN 993 12150

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