MULTILAYER WIRING BOARD
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United States of America Patent
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N/A
Issued Date -
Mar 3, 2016
app pub date -
Aug 25, 2015
filing date -
Aug 28, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A multilayer wiring board includes an insulating layers stacked on one another, lands formed on an upper surface part of the multilayer wiring board, and a differential transmission line formed on or in each of the insulating layer. An electronic component is mounted on the lands. The differential transmission line is constituted of a pair of signal lines which extend from the lands toward a signal receiving end. Each of the signal lines is provided with an open stub which extends in a stacking direction of the insulating layers, and has a same width as a width of the signal lines, one end of the open stub being connected to a corresponding one of the signal lines, and another end of the open stub being open.
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