LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Mar 3, 2016
app pub date -
Aug 14, 2015
filing date -
Sep 2, 2014
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Abstract
A light emitting diode package includes a substrate, a light emitting diode mounted on the substrate by flip chip bonding and a protective layer. The light emitting diode includes an epitaxial layer, a first electrode and a second electrode on the epitaxial layer. The first electrode and the second electrode are spaced apart from each other. The first and second electrodes are embedded in the protective layer. This disclosure also relates to a method for manufacturing the light emitting diode package.
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