SYSTEMS AND METHODS FOR USING WHITE LIGHT INTERFEROMETRY TO MEASURE UNDERCUT OF A BI-LAYER STRUCTURE
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United States of America Patent
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Issued Date -
Mar 3, 2016
app pub date -
Nov 11, 2015
filing date -
Dec 6, 2013
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Abandoned
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Abstract
Systems and methods for using white light interferometry to measure undercut of a bi-layer structure are provided. One such method involves performing a first scan of a first bi-layer structure with a microscope using a first scan range, where the microscope is configured for white light interferometry, generating a first interferogram using data from the first scan, performing a second scan of the first bi-layer structure with the microscope using a second scan range, generating a second interferogram using data from the second scan, determining a first distance between features of the first interferogram, determining a second distance between features of the second interferogram, and calculating a width of the undercut based on the first distance and the second distance. One such system involves using the microscope and/or a computer to perform one or more actions of this method.
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