METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS
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United States of America Patent
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Issued Date -
Mar 3, 2016
app pub date -
May 9, 2014
filing date -
May 13, 2013
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Abstract
The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.
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