VOIDING CONTROL USING SOLID SOLDER PREFORMS EMBEDDED IN SOLDER PASTE
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United States of America Patent
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Issued Date -
Feb 25, 2016
app pub date -
Aug 24, 2015
filing date -
Aug 25, 2014
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Abstract
Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.
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