METAL FILM FORMING METHOD AND CONDUCTIVE INK USED IN SAID METHOD
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United States of America Patent
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Feb 25, 2016
app pub date -
Aug 19, 2014
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Aug 19, 2014
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An object of the invention is to provide a simple method capable of easily forming a metal film on a surface of a perforated substrate that is adjacent to the hole in the substrate. The metal film forming method includes a step of heating a perforated substrate having a hole while a surface of the substrate adjacent to the hole is in contact with a conductive ink containing a metal salt and a reducing agent.
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