CYLINDRICAL SPUTTERING TARGET AND METHOD FOR MANUFACTURING SAME

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United States of America Patent

APP PUB NO 20160056025A1
SERIAL NO

14779603

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Abstract

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The cylindrical sputtering target is a Cu—Ga alloy cylindrical sputtering target made of a Cu alloy containing 15 atom % to 35 atom % of Ga, in which the Cu alloy has a granular crystal structure.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Shinji Sanda-shi, JP 237 2466
Komiyama, Shozo Sanda-shi, JP 12 42
Zhang, Shoubin Sanda-shi, JP 23 108

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