PHOTOSENSITIVE RESIN COMPOSITION FOR BLACK MATRIX AND APPLICATION THEREOF

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United States of America Patent

SERIAL NO

14934013

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Abstract

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The present invention relates to a photosensitive resin composition for a black matrix and an application thereof. The aforementioned photosensitive resin composition includes an alkali-soluble resin (A), a compound having an ethylenically unsaturated group (B), a photo-initiator (C), a solvent (D), a black pigment (E) and an oxetane compound having silicon atom (F). The aforementioned alkali-soluble resin (A) includes a first alkali-soluble resin (A-1) having a fluorine atom. The photosensitive resin composition for the black matrix has excellent development resistance and lower surface resistance.

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Patent Owner(s)

Patent OwnerAddress
CHI MEI CORPORATION59-1 SAN CHIA JEN TE TAINAN CITY 71702

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsieh, Li-Ting TAINAN CITY, TW 3 5
Liao, Hao-Wei KAOHSIUNG CITY, TW 18 48
Shih, Chun-An TAINAN CITY, TW 36 102
Wu, Chen-Yu Taipei City, TW 18 63

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