GLASS SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

14879788

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is aimed to provide a method for producing a glass substrate with a thickness of not more than 200 μm, which is satisfied with the quality required for a substrate on which a thin-film electric circuit is formed, and a sheet glass substrate obtained according to this method. The present invention is concerned with a method for producing a glass substrate having a sheet thickness of from 10 to 200 μm, including a forming step of forming a molten glass into a ribbon shape in accordance with a down draw method, an annealing step of annealing the glass ribbon, and a cutting step of cutting the glass ribbon to give a glass substrate, wherein an average cooling rate in a temperature range of from the (annealing point +200° C.) to the (annealing point +50° C.) is controlled to the range of from 300 to 2,500° C./min.

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Patent Owner(s)

Patent OwnerAddress
NIPPON ELECTRIC GLASS CO LTDSHIGA PREFECTURE JAPAN SHIGA

International Classification(s)

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  • 2015 Application Filing Year
  • C03C Class
  • 892 Applications Filed
  • 680 Patents Issued To-Date
  • 76.24 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AIBA, Hisatoshi Otsu-shi, JP 2 17
FUJIWARA, Katsutoshi Otsu-shi, JP 13 244
KATO, Yoshinari Otsu-shi, JP 12 127
KAWAGUCHI, Takahiro Otsu-shi, JP 238 3066

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Patent Citation Ranking

  • 3 Citation Count
  • C03C Class
  • 25.77 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges11729628921101 - 1011 - 2021 - 3031 - 4041 - 5091 - 100020406080100120140160180200220240260280300320

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