BONDED MEMBER AND METHOD FOR PRODUCING THE SAME

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United States of America Patent

SERIAL NO

14930280

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Abstract

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A microchip plate according to an embodiment includes a first substrate, a second substrate, and an adhesive layer, the first substrate and the second substrate being bonded to each other with the adhesive layer provided therebetween, in which each of the first substrate and the second substrate is composed of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC), and the adhesive layer contains a polymer of α-olefin.

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Patent Owner(s)

Patent OwnerAddress
ALPS ELECTRIC CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Taniguchi, Yoshinao Miyagi-ken, JP 7 14

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