INTERPOSER WITH CONDUCTIVE POST AND FABRICATION METHOD THEREOF

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United States of America Patent

APP PUB NO 20160049359A1
SERIAL NO

14744289

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An interposer is provided, including a substrate body, a plurality of conductive posts formed in the substrate body, and a plurality of conductive pads formed on the substrate body and electrically connected to the conductive posts. The conductive pads and the conductive posts are integrally formed. As such, no interface is formed between the conductive pads and the conductive posts, thereby preventing delamination or cracking from occurring between the conductive pads and the conductive posts.

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Patent Owner(s)

Patent OwnerAddress
SILICONWARE PRECISION INDUSTRIES CO LTDNO 123 SEC 3 DAFENG RD TANZI DIST TAICHUNG CITY 427

International Classification(s)

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  • 2015 Application Filing Year
  • H01L Class
  • 25498 Applications Filed
  • 22451 Patents Issued To-Date
  • 88.06 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsien-Wen Taichung, TW 23 114
Chen, Kuang-Hsin Taichung, TW 79 638
Chiang, Ching-Wen Taichung, TW 25 114

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1792827316886303131891006776342711301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000

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