Semiconductor Device Manufacturing Method
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United States of America Patent
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Issued Date -
Feb 18, 2016
app pub date -
Aug 5, 2015
filing date -
Aug 15, 2014
priority date (Note) -
Abandoned
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Abstract
There is provided a semiconductor device manufacturing method, including: a film forming process in which, by supplying a solution for modifying a surface layer of a resist to a target object having a resist pattern and allowing the solution to infiltrate into the resist, a film having elasticity and having no compatibility with the resist is formed in the surface layer of the resist; and a heating process in which the target object having the film formed thereon is heated.
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