MICROPHONE MODULE WITH SOUND PIPE
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United States of America Patent
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Issued Date -
Feb 11, 2016
app pub date -
Oct 22, 2015
filing date -
Nov 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
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