SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160043178A1
SERIAL NO

14452130

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

In accordance with an embodiment, a method for manufacturing a semiconductor component includes providing a semiconductor material having a surface, forming an epitaxial layer of carbon doped semiconductor material on the semiconductor substrate, the epitaxial layer having a surface, forming a nucleation layer on the epitaxial layer; and forming a layer of III-nitride material on the nucleation layer. In accordance with another embodiment, the semiconductor component includes a silicon semiconductor substrate of a first conductivity type; a carbon doped epitaxial layer on the silicon semiconductor substrate; a buffer layer over the carbon doped buffer layer; and a channel layer on the buffer layer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
DEUTSCHE BANK AG NEW YORK BRANCH AS COLLATERAL AGENT60 WALL STREET NEW YORK NY 10005

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Chun-Li Scottsdale, US 62 482
Salih, Ali Phoenix, US 86 689

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation