TRANSPARENT CONDUCTIVE SUBSTRATE PRODUCTION METHOD AND TRANSPARENT CONDUCTIVE SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Feb 11, 2016
app pub date -
Mar 25, 2014
filing date -
Mar 29, 2013
priority date (Note) -
Published
status (Latency Note)
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Abstract
[Problem] To provide: a method for producing a transparent conductive substrate that is suitable for a capacitive touch panel having high pattern recognition performance by simple processes; and a transparent conductive substrate. [Solution] First electrode regions (12) and second electrode regions (14) are printed in different positions on the same plane with use of a transparent conductive ink. After printing a first electrode connection region (16) that electrically connects the first electrode regions (12) in one direction with use of the transparent conductive ink, pulse light is irradiated thereon so that the region is sintered and formed into a conductor. After that, the surface of the first electrode connection region (16) is covered with a transparent insulating layer (18). After printing a second electrode connection region (20) that passes through the surface of the transparent insulating layer (18) and electrically connects the second electrode regions (14) in a direction that is different from the direction of the first electrode connection region (16) with use of the transparent conductive ink, pulse light is irradiated thereon so that the region is sintered and formed into a conductor.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SHOWA DENKO K K | TOKYO 105-8518 |
International Classification(s)

- 2014 Application Filing Year
- G06F Class
- 51669 Applications Filed
- 44228 Patents Issued To-Date
- 85.60 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
UCHIDA, Hiroshi | Tokyo, JP | 337 | 3104 |
# of filed Patents : 337 Total Citations : 3104 |
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Patent Citation Ranking
- 4 Citation Count
- G06F Class
- 11.69 % this patent is cited more than
- 9 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 11, 2027 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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