Method of analyzing at least two inhibitors simultaneously in a plating bath

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United States of America Patent

PATENT NO 9575032
APP PUB NO 20160041125A1
SERIAL NO

14453636

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Abstract

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The presently claimed invention provides an accurate, fast, and cost effective method for determining the additive concentrations of at least two inhibitors simultaneously in an electroplating bath by using different electrical load conditions. The method of the present invention is able to determine additive concentrations of different inhibitors effectively during on-line feedback control for adjusting the amount of additives in the electroplating bath to maintain the additive concentrations within pre-defined limits during device production.

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Patent Owner(s)

Patent OwnerAddress
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED5/F PHOTONICS CENTRE 2 SCIENCE PARK EAST AVENUE HONG KONG SCIENCE PARK SHATIN NEW TERRITORIES HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Minghui Hong Kong, HK 8 18
Sun, Yaofeng Hong Kong, HK 12 21
Xia, Hai Hong Kong, HK 12 29

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