ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM FOR CONTROLLED SUBSTRATE DEPTH
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United States of America Patent
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app pub date -
Sep 24, 2014
filing date -
Aug 8, 2014
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Abandoned
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Abstract
A roll-to-roll electroless plating system for controlled substrate depth includes electroless plating solution disposed within an electroless plating bath, a conveyor system configured to convey a roll-to-roll substrate material through the electroless plating solution, a first depth setting roller disposed at an entry location of the roll-to-roll substrate material to the electroless plating solution, and a second depth setting roller disposed at an exit location of the roll-to-roll substrate material from the electroless plating solution. A diameter of the first and the second depth setting rollers is selected to dispose the roll-to-roll substrate material at a predetermined depth of the electroless plating solution.
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