Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer
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United States of America Patent
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-
Mar 20, 2018
Issued Date -
N/A
app pub date -
Dec 3, 2013
filing date -
Dec 18, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for the at least portion-wise and adhesive metallization of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallized, within an area to be metallized that is enclosed by one or more limiting lines, by molding a tool that is microstructured in accordance with the regions to be metallized within a molding area.
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International Classification(s)
- 2013 Application Filing Year
- C23C Class
- 2155 Applications Filed
- 1819 Patents Issued To-Date
- 84.41 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 3 Citation Count
- C23C Class
- 32.86 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 20, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 20, 2029 |
