Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
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United States of America Patent
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Feb 4, 2016
app pub date -
Jul 30, 2014
filing date -
Jul 30, 2014
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Abstract
Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes providing a protective film, coupling dies to the protective film, and disposing a molding material around the dies. The protective film includes a substantially opaque material at predetermined wavelengths of light.
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